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Bare Board Testing Systems
Bare Board Testing Systems (Testers)
Semiconductor Package Testing Systems
Functional Testing Systems
Image Testing Systems
LCD, Organic EL and PDP Test Systems
Special Test Systems

Semiconductor Package Testing Systems
With the increasing level of semiconductor integration, packages are becoming more sophisticated. Nidec-Read inspection systems are advanced systems for performing continuity (Open) testing and insulation short-circuit (Leak) testing for semiconductor packages such as MCMs, CSPs and BGAs, as well as for high-density built-up boards.

Step-and-Repeat Testing System for BGAs and MCMs
  • Used for the testing of large-sized panel multiple-image boards
  • Double-sided alignment
  • Step-and-repeat mechanism
  • One-touch attachment/removal fixture
Work size: Max. 510 x 340 (D) mm (GATS-8100)
Work size: Max. 510 x 510 (D) mm (GATS-8200)
Work size: Max. 610 x 610 (D) mm (GATS-8300)
Test points: SD specifications, Upper 2048 pins, Lower 2048 pins
Test points: DD specifications, Upper 4096 pins, Lower 4096 pins


Step-and-Repeat Testing System for BGAs and MCMs/GATS-7700/GATS-7700LU Series
  • Used for the testing of single-image boards to compact-sized multiple-sided boards
  • Double-sided alignment
  • Alignment data read and board testing can be concurrently performed by using the "high-speed shuttle method"
  • Step-and-repeat mechanism
  • One-touch attachment/removal fixture
Work size: Max. 100 x 250 (D) mm
Test points: SD specifications, Upper 2048 pins, Lower 2048 pins
Test points: DD specifications, Upper 4096 pins, Lower 4096 pins


Step-and-Repeat Testing System for BGAs and MCMs/GATS-7300/GATS-7300LU Series
  • Used for the testing of single-image boards to mid-sized, multiple-image boards
  • Double-sided alignment
  • Step-and-repeat mechanism
  • One-touch attachment/removal fixture
Work size: Max. 230 x 230 (D) mm
Test points: SD specifications, Upper 2048 pins, Lower 2048 pins
Test points: DD specifications, Upper 4096 pins, Lower 4096 pins


Tray-to-Tray Automatic Testing System with Adsorption Handler for BGAs and MCMs
  • Used for the testing of single-image boards
  • Uses tray type loader/unloader integral unit
Work size: Max. 60 x 60 (D) mm
Test points: SD specifications, Upper 2048 pins, Lower 2048 pins
Test points: DD specifications, Upper 4096 pins, Lower 4096 pins


High-Speed Flying Tester/GATS-3200 Series/GATS-3300 Series
  • Sheet board/single-image board (GATS 3200)
  • Single-image board, loader/unloader integral unit (GATS 3300)
Work size: Max. 50 x 50 (D) mm (GATS-3300 Series)
Work size: Max. 150 x 200 (D) mm
Less than 50 x 50 mm for single-image board (GATS-3200 Series)
Test points: Lower fixture SD specifications 2048 pins
Test points: Lower fixture DD specifications 4096 pins

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