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Automatic optical test (AOT) systems perform high-speed continuity and insulation testing of printed circuit boards. This is done by performing image processing using new camera technology, in addition to state-of-the-art mechanical and electrical engineering.
Nidec-Read offers products from Lloyd Doyle (England) to suit the specifications of each user. |
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- High-speed 13-second testing! (10-μ resolution, 460 x 600 mm)
- Minimum L&S: 75 & 75 μ
- Equipped with reflective camera (xenon lamp illumination)
- Automatic alignment (for X, Y and Theta)
- Testing by netlist comparison and bitmap list comparison.
- CAM data linkage (netlist and bitmap list)
- Easy operation, high-speed setup (common setup)
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- High-speed 24-second testing (7.5-μ resolution, 460 x 600 mm)
- Minimum L&S: 50 & 50 μ
- Equipped with reflective and fluorescent camera (LED illumination)
- Automatic alignment (for X, Y and Theta)
- Testing by netlist comparison and bitmap list comparison
- CAM data linkage (netlist and bitmap list)
- Can handle low-contrast materials
- Easy operation, high-speed setup (common setup)
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- High-speed 13-second testing (10-μ resolution, 460 x 600 mm)
- Minimum L&S: 75 & 75 μ
- Equipped with reflective and fluorescent camera (red LED illumination)
- Automatic alignment (for X, Y and Theta)
- Testing by netlist comparison and bitmap list comparison
- CAM data linkage (netlist and bitmap list)
- Easy operation, high-speed setup (common setup)
Double camera option (10 μ, 5 μ, etc.)
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Photomask AOI
System |
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High quality and reliability have been required for
photomask due to the rapid change of line & space in PCB
to finer pitch.
Nidec-Read offers high speed and high resolution
photomask AOI (Automatic Optical Inspection) system for
damages and contamination with 1
μ
level
and Open/Short of wiring pattern.
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Highest Resolution AOI
System for Photomask
MaskView Series
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Detectable Defects : Open, Short, Protrusion,
Intrusion, Pinhole, Island
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Resolution 0.37
μm~7.4
μm
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Suitable for Glass Photomask
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Implemented Real Time Focus
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Applied Appropriate Light for Great Resolution
Inspection
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Assured Quality
-Cam Data Comparison,
Design Rule Check
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The SHR-1116 is a system that tests the height and quality of semiconductor package bumps by using state-of-the-art 2D/3D testing technology. The system can handle various types of testing of the entire semiconductor package, including bump height, volume
and warpage,
and achieves high-speed, high-accuracy testing. Nidec-Read offers products from ACERIS (Canada) to suit the specifications of each user. |
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- Can handle 70-μm microbumps (optional specifications can handle 30 μm)
- High reliability testing and surface defect detection using 2D color image processing and 3D laser measurement technology
- Easy-to-operate report management system (Database/Excel compatible)
- Integrated system combining 2D (color image processing) and 3D (laser measurement technology)
- Fully automatic inline testing
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| Height resolution: |
0.13 to 0.17 μm |
| Scan direction resolution: |
1 to 50 μm (step measurement can be done in 1-μm units) |
| Scan width: |
14 to 18 mm |
| Focal depth: |
0.3 mm |
| Profiles/second: |
7500 or higher |
| Points/profile: |
2350 |
| 3D points/second: |
60 million points |
| 2D camera resolution: |
7.5 μm/pixel (Zoom lens) |
| Scan speed: |
37 mm/sec |
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